The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Apr. 09, 2009
Sang-heung Lee, Daejeon, KR;
Hae Cheon Kim, Daejeon, KR;
Dong Min Kang, Daejeon, KR;
Dong-young Kim, Daejeon, KR;
Jae Kyoung Mun, Daejeon, KR;
Hokyun Ahn, Daejeon, KR;
Jong-won Lim, Daejeon, KR;
Woo Jin Chang, Daejeon, KR;
Hong Gu Ji, Daejeon, KR;
Eun Soo Nam, Daejeon, KR;
Sang-Heung Lee, Daejeon, KR;
Hae Cheon Kim, Daejeon, KR;
Dong Min Kang, Daejeon, KR;
Dong-Young Kim, Daejeon, KR;
Jae Kyoung Mun, Daejeon, KR;
Hokyun Ahn, Daejeon, KR;
Jong-Won Lim, Daejeon, KR;
Woo Jin Chang, Daejeon, KR;
Hong Gu Ji, Daejeon, KR;
Eun Soo Nam, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
Provided is a high-speed optical interconnection device. The high-speed optical interconnection device includes a first semiconductor chip, light emitters, optical detectors, and a second semiconductor chip, which are disposed on a silicon-on-insulator (SOI) substrate. The light emitters receive electrical signals from the first semiconductor chip to output optical signals. The optical detectors detect the optical signals to convert the optical signals into electrical signals. The second semiconductor chip receives the electrical signals converted by the optical detectors.