The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Nov. 13, 2007
Jee-soo Mok, Yongin-si, KR;
Dong-jin Park, Suwon-si, KR;
Jun-heyoung Park, Suwon-si, KR;
Ki-hwan Kim, Boryeong-si, KR;
Sung-young Kim, Suwon-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Dong-Jin Park, Suwon-si, KR;
Jun-Heyoung Park, Suwon-si, KR;
Ki-Hwan Kim, Boryeong-si, KR;
Sung-Young Kim, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.