The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2011

Filed:

Feb. 20, 2008
Applicants:

Hideo Nakamura, Toyota, JP;

Tomoyuki Watanabe, Toyota, JP;

Hirotaka Ohno, Nishikamo-gun, JP;

Nobuaki Inagaki, Seto, JP;

Inventors:

Hideo Nakamura, Toyota, JP;

Tomoyuki Watanabe, Toyota, JP;

Hirotaka Ohno, Nishikamo-gun, JP;

Nobuaki Inagaki, Seto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bus bar has a lead portion and a bus bar portion which are integrally shaped. The lead portion is provided in such a shape that branches from the bus bar portion. A part of the lead portion forms a connection part directly electrically connected with a transistor electrode and a diode electrode by a connecting material such as solder. The thickness of the lead portion including the connection part is made smaller than the thickness of the bus bar portion. Accordingly, such an interconnection structure can be provided in which the electrode of the semiconductor device and the bus bar are electrically directly connected with each other and thermal stress at the connection part therebetween can be relieved.


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