The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Jun. 13, 2008
Applicants:
Kiyoshi Nokihara, Kyoto, JP;
Yasuo Oka, Fuji, JP;
Inventors:
Kiyoshi Nokihara, Kyoto, JP;
Yasuo Oka, Fuji, JP;
Assignees:
Hipep Laboratories, Kyoto-shi, JP;
Nippon Light Metal Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J 19/00 (2006.01); B01J 8/02 (2006.01); B01J 35/02 (2006.01); B01J 8/00 (2006.01); B01J 10/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.