The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2011

Filed:

Feb. 19, 2007
Applicants:

Otto W. Stenzel, Herrsching, DE;

Stefan Wagner, Bad Honnef, DE;

Dittmar Lange, Munich, DE;

Inventors:

Otto W. Stenzel, Herrsching, DE;

Stefan Wagner, Bad Honnef, DE;

Dittmar Lange, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/00 (2006.01); E01C 19/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A soil compaction device has a vibrated contact element that makes contact with the soil during a contact phase and that is exposed to a contact force exerted by the soil and travels over a contact distance. A dynamic stiffness of the soil is formed from the gradient of the contact force and from the contact distance. Furthermore, a contact surface parameter to take account of the actual contact surface of the contact element with the soil is determined. The dynamic deformation modulus is then the product of the contact surface parameter and the dynamic stiffness. The method allows the determination of the dynamic deformation modulus, and hence of the soil stiffness, during the compaction operation.


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