The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Sep. 24, 2009
Young Lyong Kim, Seongnam-si, KR;
Jongho Lee, Hwaseong-si, KR;
Cheul-joong Youn, Seoul, KR;
Eunchul Ahn, Yongin-si, KR;
Young Lyong Kim, Seongnam-si, KR;
Jongho Lee, Hwaseong-si, KR;
Cheul-Joong Youn, Seoul, KR;
Eunchul Ahn, Yongin-si, KR;
Abstract
A semiconductor package includes a first package including at least one first semiconductor chip; a second package including an external connection terminal and at least one second semiconductor chip, the second package being stacked on the first package; and an interposer disposed between the first and second packages and connected to the external connection terminal to electrically connect the first and second packages to each other. The interposer comprises an intermediate connector having an exposed end portion to which the second package is electrically connected via the external connection terminal and a protruding end portion lower than the exposed end portion to which the first package is electrically connected.