The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2011

Filed:

Dec. 27, 2007
Applicants:

Chun-wei Wang, Miao-Li Hsien, TW;

Hung-kuang Hsu, Miao-Li Hsien, TW;

Wen-jang Jiang, Miao-Li Hsien, TW;

Inventors:

Chun-Wei Wang, Miao-Li Hsien, TW;

Hung-Kuang Hsu, Miao-Li Hsien, TW;

Wen-Jang Jiang, Miao-Li Hsien, TW;

Assignee:

Foxsemicon Integrated Technology, Inc., Chu-Nan, Miao-Li Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

A solid state light emitting device includes a laminated substrate structure (), an LED chip (), a transparent capsulation material () and an electric component (). The laminated substrate structure includes a first substrate () and a second substrate () attached to each other by a sintering process. The first substrate has a mounting surface () and a receiving through hole () defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.


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