The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2011

Filed:

Mar. 16, 2005
Applicants:

Takaki Nakagawa, Tochigi, JP;

Takahiro Yoshida, Utsunomiya, JP;

Hiroyuki Tanaka, Utsunomiya, JP;

Takashi Kosaka, Utsunomiya, JP;

Inventors:

Takaki Nakagawa, Tochigi, JP;

Takahiro Yoshida, Utsunomiya, JP;

Hiroyuki Tanaka, Utsunomiya, JP;

Takashi Kosaka, Utsunomiya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/14 (2006.01); H01M 2/00 (2006.01); H01M 2/02 (2006.01); H01M 2/08 (2006.01); H01M 8/00 (2006.01); H01M 8/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first seal member is formed integrally on both surfaces of a first metal plate. The first seal member is integrally formed on a cooling surface of the first metal plate, except a region corresponding to a reaction surface facing an electrode reaction surface, and except regions of inlet buffers and outlet buffers. The first seal member has an expansion. The position of an end surface of the expansion substantially matches the position of a wall surface of the outermost groove of a coolant flow field to prevent the flow of a coolant around the electrode reaction surface.


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