The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8052941 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 08, 2011

Filed:

Jul. 02, 2008
Applicants:

June-young Lee, Anyang-si, KR;

Dong-ho Lee, Seongnam-si, KR;

Inventors:

June-Young Lee, Anyang-si, KR;

Dong-Ho Lee, Seongnam-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/75 (2006.01); C12M 1/34 (2006.01); B65B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.


Find Patent Forward Citations

Lee, June-Young. (2011). Packages, biochip kits and methods of packaging (U.S. Patent No. 8052941). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8052941

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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