The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Mar. 06, 2009
Kazunori Okada, Hyogo, JP;
Yoshihiro Hirata, Hyogo, JP;
Shinji Inazawa, Osaka, JP;
Masao Sakuta, Itami, JP;
Yoshiaki Tani, Amagasaki, JP;
Teruhisa Sakata, Amagasaki, JP;
Kazunori Okada, Hyogo, JP;
Yoshihiro Hirata, Hyogo, JP;
Shinji Inazawa, Osaka, JP;
Masao Sakuta, Itami, JP;
Yoshiaki Tani, Amagasaki, JP;
Teruhisa Sakata, Amagasaki, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.