The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
May. 13, 2008
Takemi Miyazaki, Hamura, JP;
Shigeru Hosoe, Hachioji, JP;
Yuiti Fujii, Hino, JP;
Konica Minolta Opto, Inc., Tokyo, JP;
Abstract
Provided is an injection nozzle and a molding apparatus which ensure injection pressure by suppressing resin leakage even when a resin material having a low viscosity is used. In injection molding, it is especially important that the injection nozzle and a fixed die are excellently kept in contact with each other and that the resin is not leaked. Resin leakage from between the injection nozzle and the fixed die lowers molding pressure, increases molding shrinkage of the resin, and directly affects the qualities of a molded product resulting in generation of a sink, transfer failure and the like. Since an O-ring in a circumferential groove of the nozzle closely comes in contact with a concave spherical surface while elastically transforming on the entire circumference, leakage is effectively suppressed even the resin is a heat-curable resin having a low viscosity.