The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Nov. 10, 2009
Minill Kim, Cheonan-si, KR;
Taegyeong Chung, Suwon-si, KR;
Jonggi Lee, Yongin-si, KR;
Kwang Yong Lee, Anyang-si, KR;
Minill Kim, Cheonan-si, KR;
Taegyeong Chung, Suwon-si, KR;
Jonggi Lee, Yongin-si, KR;
Kwang Yong Lee, Anyang-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.