The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Mar. 24, 2008
Applicants:
Xuesong Xu, Tianjin, CN;
Meijiang Song, Tianjin, CN;
Jinzhong Yao, Tianjin, CN;
Inventors:
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/56 (2006.01); H01R 43/00 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.