The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2011

Filed:

Jul. 10, 2006
Applicant:

Jin Murayama, Kurokawa-gun, JP;

Inventor:

Jin Murayama, Kurokawa-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H01L 29/18 (2006.01); H01L 29/768 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solid state image pickup device includes: a semiconductor substrate; a well formed in a surface layer of the semiconductor substrate; a light reception region formed in the well and including a plurality of charge accumulation regions formed in a matrix shape and a plurality of vertical CCDs formed along each column of the charge accumulation regions; a horizontal CCD formed in the well and coupled to ends of the vertical CCDs; a peripheral circuit formed in the well in partial regions of the light reception region and the horizontal CCD; a shield layer formed on the semiconductor substrate including a partial area above the peripheral circuit, made of conductive material and surrounding the light reception region, the shield layer being electrically connected to the semiconductor substrate; a support disposed above the shield layer and made of conductive material; and a translucent member placed on the support.


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