The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Mar. 22, 2006
Jeffrey Hall, San Jose, CA (US);
Shawn Nikoukary, Santa Clara, CA (US);
Amar Amin, Milpitas, CA (US);
Michael Jenkins, San Jose, CA (US);
Jeffrey Hall, San Jose, CA (US);
Shawn Nikoukary, Santa Clara, CA (US);
Amar Amin, Milpitas, CA (US);
Michael Jenkins, San Jose, CA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
An integrated circuit package substrate includes a first and an additional electrically conductive layer separated from each other by an electrically insulating layer, a contact pad formed in the first electrically conductive layer for making a direct connection between the integrated circuit package substrate and a printed circuit board, and a cutout formed in the additional electrically conductive layer wherein the cutout encloses an area that completely surrounds the contact pad for avoiding parasitic capacitance between the additional electrically conductive layer and the printed circuit board.