The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Mar. 02, 2009
Yin-chao Huang, Taipei Hsien, TW;
Shi-bai Chen, Hsinchu County, TW;
Kang-wei Hsueh, Hsinchu, TW;
Hung-sung LI, Hsinchu County, TW;
Yin-Chao Huang, Taipei Hsien, TW;
Shi-Bai Chen, Hsinchu County, TW;
Kang-Wei Hsueh, Hsinchu, TW;
Hung-Sung Li, Hsinchu County, TW;
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.