The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Dec. 31, 2008
Huang Yi Dong, Beijing, CN;
Rao Yi, Beijing, CN;
Liu Fang, Beijing, CN;
Zhang Wei, Beijing, CN;
Peng Jiang DE, Beijing, CN;
Dai Ohnishi, Kyoto, JP;
Daisuke Niwa, Kyoto, JP;
Atsushi Tazuke, Kyoto, JP;
Yoshikatsu Miura, Kyoto, JP;
Huang Yi Dong, Beijing, CN;
Rao Yi, Beijing, CN;
Liu Fang, Beijing, CN;
Zhang Wei, Beijing, CN;
Peng Jiang De, Beijing, CN;
Dai Ohnishi, Kyoto, JP;
Daisuke Niwa, Kyoto, JP;
Atsushi Tazuke, Kyoto, JP;
Yoshikatsu Miura, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Tsinghua University, Beijing, CN;
Abstract
There is provided a sensing chip capable of measuring a refractive index by utilizing a long-range surface plasmon polariton, accurately measuring an accumulative refractive index in a wide range, and more easily enabling sealing for measurement. The present invention relates to the sensing chip which has a thin metal film or a strip-like metal grown on an underlayer, and has a dielectric that limits a refractive index and a dielectric buffer layer on an upper surface and a lower surface of the thin metal film or the strip-like metal. The dielectric buffer layer is attached onto the thin metal film or the strip-like metal. The thin metal film or the strip-like metal and the buffer layer are sandwiched between two dielectric layers. A hole is made in a surface of the upper dielectric layer to serve as a measurement groove.