The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Sep. 24, 2009
Applicants:
Kiyoharu Takano, Oita, JP;
Makoto Yoshino, Beppu, JP;
Yoshimi Takahashi, Beppu, JP;
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substratethat includes on the surface multiple semiconductor chipsand liquid resinsupplied to multiple semiconductor devices is supported by an electrically insulated lower die. An upper diein which multiple shape-forming parts (cavities)are formed is pressed against lower diethrough the medium of a polymer release film, and liquid resinon the substrate is molded.