The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2011

Filed:

Aug. 16, 2006
Applicants:

Hideki Sumi, Fukuoka, JP;

Takahiro Noda, Fukuoka, JP;

Inventors:

Hideki Sumi, Fukuoka, JP;

Takahiro Noda, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.


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