The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jul. 25, 2007
Fumitomo Takano, Tochigi, JP;
Shinya Watanabe, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Joji Nakashima, Tochigi, JP;
Hiroshi Otsuka, Wako, JP;
Fumitomo Takano, Tochigi, JP;
Shinya Watanabe, Tochigi, JP;
Tsukasa Aiba, Tochigi, JP;
Joji Nakashima, Tochigi, JP;
Hiroshi Otsuka, Wako, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes first and second assembled bodies (A,B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar () connected to one surface of the first semiconductor chip, a first metal wiring board (-) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (-) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar () connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (-) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (-) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.