The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jun. 24, 2008
Yen Fu, San Jose, CA (US);
Ellis T. Cha, San Ramon, CA (US);
Po-kang Wang, San Jose, CA (US);
Hong Tian, New Territory, HK;
Manuel Hernandez, San Jose, CA (US);
Yaw-shing Tang, Saratoga, CA (US);
Ben HU, Los Altos Hills, CA (US);
Yen Fu, San Jose, CA (US);
Ellis T. Cha, San Ramon, CA (US);
Po-Kang Wang, San Jose, CA (US);
Hong Tian, New Territory, HK;
Manuel Hernandez, San Jose, CA (US);
Yaw-Shing Tang, Saratoga, CA (US);
Ben Hu, Los Altos Hills, CA (US);
SAE Magnetics (HK) Ltd., Shatin, N.T., HK;
Abstract
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.