The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jan. 19, 2007
Noboru Akiyama, Hitachinaka, JP;
Takayuki Hashimoto, Tokai, JP;
Masaki Shiraishi, Hitachinaka, JP;
Tetsuya Kawashima, Hitachi, JP;
Koji Tateno, Takasaki, JP;
Nobuyoshi Matsuura, Takasaki, JP;
Noboru Akiyama, Hitachinaka, JP;
Takayuki Hashimoto, Tokai, JP;
Masaki Shiraishi, Hitachinaka, JP;
Tetsuya Kawashima, Hitachi, JP;
Koji Tateno, Takasaki, JP;
Nobuyoshi Matsuura, Takasaki, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A power supply capable of reducing loss of large current and high frequency. In an MCM for power supply in which a high-side power MOSFET chip, a low-side power MOSFET chip and a driver IC chip driving them are sealed in one sealing material (a capsulating insulation resin), a wiring length of a wiring DL connecting an output terminal of the driver IC chip to a gate terminal of the low-side power MOSFET chip or a source terminal is made shorter than a wiring length of a wiring DH connecting the output terminal of the driver IC chip to a gate terminal of the high-side power MOSFET chip or a source terminal. Further, the number of the wiring DL is made larger than the number of the wiring DH.