The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jan. 24, 2006
Shingetsu Yamada, Nagahama, JP;
Shingetsu Yamada, Nagahama, JP;
Mitsubishi Plastics, Inc., Tokyo, JP;
Abstract
A multilayer printed circuit board is characterized in that circuit boardsandand a circuit boardare laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boardsandincluding a film-, thin plate-, or sheet-like insulating substratemade of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit boardincluding a film-, thin plate-, or sheet-like insulating substratemade of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile