The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Feb. 09, 2010
Takayuki Matsushima, Tochigi, JP;
Masao Saito, Tochigi, JP;
Takayuki Matsushima, Tochigi, JP;
Masao Saito, Tochigi, JP;
Sony Chemical and Information Device Corp., Tokyo, JP;
Abstract
A latent curing agent () of the present invention includes a core member () and a capsule () covering up the surface of the core member (). The core member () includes a secondary particle () and a curing agent () retained in a gap () of the secondary particle (). The curing agent () is liquid at ambient temperature. When the capsule () is destructed so that the curing agent () is emitted into an adhesive, the curing agent () is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent () and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.