The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Jan. 15, 2008
Hideya Murai, Minato-ku, JP;
Yuji Kayashima, Kawasaki, JP;
Takehiko Maeda, Kawasaki, JP;
Shintaro Yamamichi, Minato-ku, JP;
Takuo Funaya, Minato-ku, JP;
Hideya Murai, Minato-ku, JP;
Yuji Kayashima, Kawasaki, JP;
Takehiko Maeda, Kawasaki, JP;
Shintaro Yamamichi, Minato-ku, JP;
Takuo Funaya, Minato-ku, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device that can be readily manufactured, can include a large number of pads, and can be thin, and a method for manufacturing the same are provided. The semiconductor device is characterized in that the semiconductor device includes an LSI chip, an insulating layer provided on the LSI chip and made of a nonphotosensitive resin, the insulating layer including a via hole in the position corresponding to an externally connected pad, and a wiring layer extending along the insulating layer through the via hole to the externally connected pad, and at least part of the via hole is formed by irradiating the insulating layer with laser light.