The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2011

Filed:

Sep. 10, 2008
Applicants:

Shingo Eguchi, Tochigi, JP;

Yohei Monma, Tochigi, JP;

Atsuhiro Tani, Utsunomiya, JP;

Misako Hirosue, Naka, JP;

Kenichi Hashimoto, Shimotsuga, JP;

Yasuharu Hosaka, Shimotsuga, JP;

Inventors:

Shingo Eguchi, Tochigi, JP;

Yohei Monma, Tochigi, JP;

Atsuhiro Tani, Utsunomiya, JP;

Misako Hirosue, Naka, JP;

Kenichi Hashimoto, Shimotsuga, JP;

Yasuharu Hosaka, Shimotsuga, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/322 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01); H01G 9/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.


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