The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Sep. 30, 2008
Hwa-young Lee, Suwon-si, KR;
Ho-joon Park, Seoul, KR;
Jin Cheol Kim, Hwaseong-si, KR;
Sang-jun Yoon, Seoul, KR;
Geum-hee Yun, Yongin-si, KR;
Jun-rok OH, Seoul, KR;
Hwa-Young Lee, Suwon-si, KR;
Ho-Joon Park, Seoul, KR;
Jin Cheol Kim, Hwaseong-si, KR;
Sang-Jun Yoon, Seoul, KR;
Geum-Hee Yun, Yongin-si, KR;
Jun-Rok Oh, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.