The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Apr. 19, 2006
Kenji Kawai, Aichi, JP;
Hirokazu Oogi, Aichi, JP;
Kenji Kawai, Aichi, JP;
Hirokazu Oogi, Aichi, JP;
Toyo Boseki Kabushiki Kaisha, Osaka-shi, JP;
Abstract
[Problem] Provision of a heat-sealable multilayer polypropylene-based resin film having heat seal strength sufficient for packaging a heavy article and tight-sealing property, and a packaging material using the film. [Solving means] A heat-sealable multilayer polypropylene-based resin film comprising a crystalline polypropylene-based resin and a propylene-α-olefin copolymer, which is an oriented polypropylene-based resin film made of a laminate of 3 or more layers of a substrate layer having a melting point of 155° C. or less, an intermediate layer and a thermal adhesion layer having a melting point of 150° C. or less, wherein the intermediate layer has a xylene-soluble content of 2.5% or less, the substrate layer has a melting point higher than that of the intermediate layer, and the intermediate layer has a thickness of 4 μm or above.