The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Oct. 31, 2007
Yoshio Shikase, Aichi-ken, JP;
Michitaka Hattori, Aichi-ken, JP;
Shigeru Nozaki, Aichi-ken, JP;
Satoshi Imaeda, Aichi-ken, JP;
Toshihiko Kariya, Aichi-ken, JP;
Yoshio Shikase, Aichi-ken, JP;
Michitaka Hattori, Aichi-ken, JP;
Shigeru Nozaki, Aichi-ken, JP;
Satoshi Imaeda, Aichi-ken, JP;
Toshihiko Kariya, Aichi-ken, JP;
Mitsubishi Heavy Industries Plastics Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Abstract
There are provided an injection molding system, a computer program, a method of injection molding, and an injection molding machine capable of performing precise temperature control of a mold even when there is a delay in temperature increase of the mold in heat supply with a heating medium. The temperature control is performed so that temperatures of a fixed mold and a movable mold are maintained between an upper limit TU and a lower limit TL of a predetermined temperature range after start of injection of resin during an injection molding cycle. The temperature control of the fixed mold and the movable mold is performed only by switching ON/OFF supply of the heating medium, and cooling with a cooling medium is not performed. In a process of cooling the resin, the temperature control is performed so that the temperatures of the fixed mold and the movable mold are maintained between an upper limit TUa and a lower limit TLa of a temperature range effective for resin annealing by stop of supply of the cooling medium and the supply and stop of the heating medium.