The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2011

Filed:

Nov. 17, 2009
Applicants:

Hee Kyung Kim, El Segundo, CA (US);

Fangchou Yang, Los Angeles, CA (US);

Alberto F. Viscarra, Torrance, CA (US);

Clifton Quan, Arcadia, CA (US);

Derek Pruden, Redondo Beach, CA (US);

Inventors:

Hee Kyung Kim, El Segundo, CA (US);

Fangchou Yang, Los Angeles, CA (US);

Alberto F. Viscarra, Torrance, CA (US);

Clifton Quan, Arcadia, CA (US);

Derek Pruden, Redondo Beach, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B29C 65/00 (2006.01); C09J 5/04 (2006.01); H01Q 13/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.


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