The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Mar. 28, 2007
Hee Gyoun Lee, Uiwang-si, KR;
Gye Won Hong, Seongnam-si, KR;
Kyeong Dal Choi, Seoul, KR;
Korea Polytechnic University, , KR;
Abstract
The present invention relates to a method for fabricating a filament type high-temperature superconducting wire in which a thin film type high-temperature superconducting wire is fabricated into a filament shape suitable for use with alternating current. The method includes depositing a conducting ceramic or metal epitaxially on a metal substratehaving bi-axially textured property to deposit a conductive thin film layer(S); depositing silver, copper, nickel, silver and copper, or a nickel alloy epitaxially on the deposited conductive thin film layerto deposit a metal layer(S); cutting the deposited metal layerinto a filament shape having a predetermined width using a laser, a slitter, or etching and separating the cut metal layer from the conductive film layerby selective etching, stress generation, or a difference in thermal expansion coefficients to form a metal filament(S); coating a single layer or multi-layers of a ceramic buffer layeron the outside of the separated metal filament(S); coating a superconducting layeron the outside of the ceramic buffer layer(S); and coating a single layer or multi-layers of a metal protective layeron the outside of the superconducting layer(S).