The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Aug. 06, 2007
Andreas Ostmann, Berlin, DE;
Alexander Neumann, Berlin, DE;
Dionysios Manessis, Berlin, DE;
Rainer Patzelt, Berlin, DE;
Andreas Ostmann, Berlin, DE;
Alexander Neumann, Berlin, DE;
Dionysios Manessis, Berlin, DE;
Rainer Patzelt, Berlin, DE;
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Munich, DE;
Technische Universitaet Berlin, Berlin, DE;
Abstract
A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.