The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Dec. 14, 2007
Jun-qing Zhang, Shenzhen, CN;
Chih-yi Tu, Taoyuan, TW;
Szu-min Huang, Taoyuan, TW;
FuKui Precision Component (Shenzhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.