The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Aug. 22, 2005
Anthony L. Coyle, Plano, TX (US);
Bernhard P. Lange, Garland, TX (US);
Anthony L. Coyle, Plano, TX (US);
Bernhard P. Lange, Garland, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A high current semiconductor device (for example QFN for 30 to 70 A) with low resistance and low inductance is encapsulated by molding compound (, heightabout 0.9 mm) so that the second lead surfacesremain un-encapsulated. A copper heat slug () may be attached to chip surface () using thermally conductive adhesive (). Chip surface (), protected by an overcoat () has metallization traces (). Copper-filled windows () contact the traces and copper layers () parallel to traces (). Copper bumps () are formed on each line in an orderly and repetitive arrangement so that the bumps of one line are positioned about midway between the bumps of the neighboring lines. A substrate has elongated leads () oriented at right angles to the lines; the leads connect the corresponding bumps of alternating lines.