The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2011

Filed:

May. 11, 2009
Applicants:

Chien-te Feng, Shindian, TW;

Frank Yu, Chung Ho, TW;

Inventors:

Chien-Te Feng, Shindian, TW;

Frank Yu, Chung Ho, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mold lock and a method of forming the mold lock are provided. The mold lock is used in an encapsulated semiconductor device and includes a neck and a shaped head integral with the neck. The mold lock can be formed to project above a support component, such as a heat spreader, of the semiconductor device and the neck is formed from the support component. The shaped head is of a greater dimension than the neck and can present a 'T' shape in side view or a 'Y' shape in side view. A base portion of the neck is seated within the support component. A method is provided for forming the described mold lock.


Find Patent Forward Citations

Feng, Chien-Te. (2011). Mold lock on heat spreader (U.S. Patent No. 8039955). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8039955

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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