The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8039927 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 18, 2011

Filed:

Mar. 23, 2006
Applicants:

Toshihiro Nakamura, Tokyo, JP;

Nobuaki Orita, Tokyo, JP;

Hisashi Koaizawa, Tokyo, JP;

Kenkichi Suzuki, Tsukuba, JP;

Hiroshi Kuraseko, Tokyo, JP;

Michio Kondo, Tsukuba, JP;

Inventors:

Toshihiro Nakamura, Tokyo, JP;

Nobuaki Orita, Tokyo, JP;

Hisashi Koaizawa, Tokyo, JP;

Kenkichi Suzuki, Tsukuba, JP;

Hiroshi Kuraseko, Tokyo, JP;

Michio Kondo, Tsukuba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The linear semiconductor substrateorof the present invention comprises at least one desired thin filmformed on a linear substratehaving a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin filmforms a linear semiconductor thin film. The linear semiconductor substrateorof the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.


Find Patent Forward Citations

Nakamura, Toshihiro. (2011). Linear semiconductor substrate, and device, device array and module, using the same (U.S. Patent No. 8039927). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8039927

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