The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Feb. 20, 2009
Shinya Yanbe, Tochigi, JP;
Kazuo Maruyama, Miyagi, JP;
Takashi Ikeda, Tochigi, JP;
Tetsu Miyamoto, Saitama, JP;
Shinya Yanbe, Tochigi, JP;
Kazuo Maruyama, Miyagi, JP;
Takashi Ikeda, Tochigi, JP;
Tetsu Miyamoto, Saitama, JP;
Keihin Corporation, Tokyo, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A heat dissipating structure of a print circuit board to improve heat-dissipation efficiency for mounted electronic components while retaining required soldering strength is disclosed. The heat dissipation structure of a print circuit board comprising a stack of multiple layers including a mounting surface layer on which electronic components including heat generating components are soldered. On both sides of the print circuit board, inner vias bore surface layers but inner layers are not bored. Core vias bore the inner layers in the print circuit board but the surface layers are not bored. The inner vias and the core vias are positioned at the predetermined distance over the layer surface. Heat from heat generating components is conducted through the inner vias on surface layers and the core vias inside the circuit board to the outside, high efficiency of the heat-dissipation is achieved.