The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Dec. 10, 2004
Moritz-andreas Meyer, Dresden, DE;
Hans-juergen Engelmann, Dresden, DE;
Ehrenfried Zschech, Moritzburg, DE;
Peter Huebler, Coswig, DE;
Moritz-Andreas Meyer, Dresden, DE;
Hans-Juergen Engelmann, Dresden, DE;
Ehrenfried Zschech, Moritzburg, DE;
Peter Huebler, Coswig, DE;
Globalfoundries Inc., Grand Cayman, KY;
Abstract
An alloy forming dopant material is deposited prior to the formation of a copper line, for instance by incorporating the dopant material into the barrier layer, which is then driven into the vicinity of a weak interface by means of a heat treatment. As indicated by corresponding investigations, the dopant material is substantially transported to the weak interface through grain boundary regions rather than through the bulk copper material (copper grains), thereby enabling moderately high alloy concentrations in the vicinity of the interface while maintaining a relatively low overall concentration within the grains. The alloy at the interface reduces electromigration along the interface.