The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Jul. 03, 2007
Yuichiro Sano, Mito, JP;
Toru Miyasaka, Hitachinaka, JP;
Yuichiro Sano, Mito, JP;
Toru Miyasaka, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation deviceforms, after forming a precursor circuit-patternin the surface of a dielectric thin film body, a circuit patternonto a target substratefrom the dielectric thin film body. After forming an electrostatic latent imagein the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unitto prepare a pattern. A development apparatussupplies a conductive particle dispersion solutionto this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate, in which an adhesive layeris formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heaterto form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.