The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2011

Filed:

Jul. 18, 2008
Applicants:

Naoji Kashima, Aichi, JP;

Shigeo Nagaya, Aichi, JP;

Kunihiro Shima, Gunma, JP;

Shuichi Kubota, Gunma, JP;

Inventors:

Naoji Kashima, Aichi, JP;

Shigeo Nagaya, Aichi, JP;

Kunihiro Shima, Gunma, JP;

Shuichi Kubota, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B05D 5/00 (2006.01); B05D 1/18 (2006.01); C25D 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (Δφ and Δω) in the textured metal layer surface and orientation degrees (Δφ and Δω) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved. At this time, the surface roughness of the substrate surface becomes 20 nm or less.


Find Patent Forward Citations

Loading…