The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Sep. 13, 2005
Yoshifumi Itabashi, Tokyo, JP;
Yoshihiro Jizo, Tokyo, JP;
Akihiro Fujita, Tokyo, JP;
Keizou Yoshikawa, Aichi, JP;
Tsuyoshi Fujimoto, Aichi, JP;
Hiromori Ishihara, Aichi, JP;
Nobuhiko Mizuno, Aichi, JP;
Futoshi Yonekawa, Chiba, JP;
Tomomi Hasegawa, Chiba, JP;
Yoshifumi Itabashi, Tokyo, JP;
Yoshihiro Jizo, Tokyo, JP;
Akihiro Fujita, Tokyo, JP;
Keizou Yoshikawa, Aichi, JP;
Tsuyoshi Fujimoto, Aichi, JP;
Hiromori Ishihara, Aichi, JP;
Nobuhiko Mizuno, Aichi, JP;
Futoshi Yonekawa, Chiba, JP;
Tomomi Hasegawa, Chiba, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Central Japan Rail Way Company, Nagoya-Shi, Aichi, JP;
Idemitsu Kosan Co., Ltd., Chiyoda-Ku, Tokyo, JP;
Abstract
A process for producing a molding having an embedded member which comprises: a first step in which a mold () having pins () which extend from the outside to the inside of the mold and can be withdrawn outward is heated to a given temperature; a second step in which a member () to be embedded is held in a given position within the mold by supporting the member, including an upper part thereof, with the pins (); a third step in which a thermoplastic resin is packed through a gate () first into that part of the cavity of the mold () which is located under the member to be embedded to thereby cause the thermoplastic resin to press the member against the pin () located in an upper part of the mold; a fourth step in which the thermoplastic resin is packed into the remaining part of the cavity of the mold (); and a fifth step in which the pins () are withdrawn successively from the lower side of the mold before cooling to a temperature at which the thermoplastic resin solidifies and loses its flowability.