The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2011

Filed:

Oct. 31, 2008
Applicants:

Naoki Takahashi, Sendai, JP;

Toshihiko Nishiyama, Sendai, JP;

Satoshi Suzuki, Sendai, JP;

Ryuta Kobayakawa, Sendai, JP;

Tomoki Nobuta, Sendai, JP;

Inventors:

Naoki Takahashi, Sendai, JP;

Toshihiko Nishiyama, Sendai, JP;

Satoshi Suzuki, Sendai, JP;

Ryuta Kobayakawa, Sendai, JP;

Tomoki Nobuta, Sendai, JP;

Assignee:

NEC Tokin Corporation, Sendai-Shi, Miyagi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solid electrolytic capacitor manufacturing method includes a process of removing a roughened surface layer (') from a distal portion () of a metal member () and from part of an intermediate portion () adjacent to the distal portion (), a process of forming a resist () on the distal portion () and the intermediate portion () of the metal member (), a process of forming a conductive polymer layer () of a conductive polymer on a proximal portion () of the metal member (), and a process of removing a resist (′) and a surface layer portion (′) of the metal member () from the distal portion () of the metal member ().


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