The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Mar. 14, 2008
Hendrik F. Hamann, Yorktown Heights, NY (US);
Madhusudan K. Iyengar, Kingston, NY (US);
James A. Lacey, Mahopac, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
Hendrik F. Hamann, Yorktown Heights, NY (US);
Madhusudan K. Iyengar, Kingston, NY (US);
James A. Lacey, Mahopac, NY (US);
Roger R. Schmidt, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.