The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Mar. 17, 2009
William R. Ratcliffe, Thousand Oaks, CA (US);
William R. Ratcliffe, Thousand Oaks, CA (US);
Other;
Abstract
Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit path has a near side facing the substrate and has a far side facing away from the substrate. A circuit element has at least one bonding pad and is inserted into the opening after which the conductive bump is arranged to join the pad to the path. In another embodiment, the bump joins the pad to the near side of the path. In another embodiment, the path defines a hole and the bump fills the hole. In yet another system embodiment, the opening comprises a recess and associated vias. These embodiments may also have a second conductive circuit path carried on the first side and having a near side facing the substrate and a far side facing away from the substrate. The systems may then include a second circuit element and at least one second conductive bump.