The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Jul. 25, 2007
Sung-hae Jung, Daejeon, KR;
Myung-lae Lee, Daejeon, KR;
Gunn Hwang, Seoul, KR;
Chang-kyu Kim, Daejeon, KR;
Chang-han Je, Jinju, KR;
Chang-auck Choi, Daejeon, KR;
Sung-Hae Jung, Daejeon, KR;
Myung-Lae Lee, Daejeon, KR;
Gunn Hwang, Seoul, KR;
Chang-Kyu Kim, Daejeon, KR;
Chang-Han Je, Jinju, KR;
Chang-Auck Choi, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.