The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2011

Filed:

Jul. 16, 2009
Applicants:

Suk-hun Choi, Suwon-si, KR;

Chang-ki Hong, Seongnam-si, KR;

Yoon-ho Son, Yongin-si, KR;

Ju-young Jung, Seoul, KR;

Inventors:

Suk-Hun Choi, Suwon-si, KR;

Chang-Ki Hong, Seongnam-si, KR;

Yoon-Ho Son, Yongin-si, KR;

Ju-Young Jung, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plug comprises a first insulating interlayer, a tungsten pattern and a tungsten oxide pattern. The first insulating interlayer has a contact hole formed therethrough on a substrate. The tungsten pattern is formed in the contact hole. The tungsten pattern has a top surface lower than an upper face of the first insulating interlayer. The tungsten oxide pattern is formed in the contact hole and on the tungsten pattern. The tungsten oxide pattern has a level face.


Find Patent Forward Citations

Quick Actions:

Choi, Suk-Hun. (2011). Method of forming a seam-free tungsten plug (U.S. Patent No. 8034705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8034705

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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