The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Nov. 27, 2007
Naoki Komai, Kanagawa, JP;
Takuya Nakamura, Kanagawa, JP;
Naoki Komai, Kanagawa, JP;
Takuya Nakamura, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device includes the steps of providing an element forming layer on a first surface of a semiconductor substrate, and providing an external connection terminal on a second surface of the semiconductor substrate opposite to the first surface so that the external connection terminal is electrically connected to the element forming layer through a via hole. The via hole is formed through the steps of forming a buried conductor layer on the first surface so as to electrically insulate the buried conductor layer from the semiconductor substrate, forming a communication hole on the second surface so as to communicate it with the buried conductor layer, and electrically connecting the buried conductor layer and the communication hole.