Production method of semiconductor device and bonding film

Abstract

To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered productin which a dicing tape, an adhesive layer, and a semiconductor waferare stacked in this order so that a circuit surfaceof the semiconductor wafermay face the dicing tapeside. A cutting position is recognized by recognizing a circuit pattern P in the circuit surfacefrom a rear surfaceof the semiconductor wafer. At least the semiconductor waferand the adhesive layerare cut in the thickness direction of the layered product. The dicing tapeis cured to peel off the dicing tapeand the adhesive layer. A projection electrodeof a semiconductor chipis aligned with a wiringof a wiring substrate. The wiring substrateand the semiconductor chipare bonded via an adhesive layerso that the wiringand the projection electrodemay be electrically connected to each other.