The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Mar. 24, 2006
Kazuhiro Nishida, Minami-ashigara, JP;
Hitoshi Shimamura, Kurokawa-gun, JP;
Kosuke Takasaki, Minami-ashigara, JP;
Kazuhiro Nishida, Minami-ashigara, JP;
Hitoshi Shimamura, Kurokawa-gun, JP;
Kosuke Takasaki, Minami-ashigara, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
A plurality of sensor packages () are fixed to a circuit assembly board () and placed on a lower mold die () of a transfer molding apparatus (). Attached inside a cavity () of an upper mold die () is a protection sheet (), which will make contact with the upper face of a cover glass () of each sensor package (). When the upper mold die () meshes with the lower mold die (), the upper face of the cover glass () is tightly covered with the protection sheet (). A plunger () is activated to fill the cavities () with sealing resin (). The upper face of the cover glass () is not stained or damaged when the peripheries of the sensor packages () are sealed.