The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2011
Filed:
Sep. 19, 2003
Xuejun Kang, Singapore, SG;
Daike Wu, Singapore, SG;
Edward Robert Perry, Sedona, AZ (US);
Shu Yuan, Singapore, SG;
Xuejun Kang, Singapore, SG;
Daike Wu, Singapore, SG;
Edward Robert Perry, Sedona, AZ (US);
Shu Yuan, Singapore, SG;
Tinggi Technologies Private Limited, Singapore, SG;
Abstract
A method for fabrication of a semiconductor device on a substrate, the semiconductor having a wafer. The method includes the steps:(a) applying a seed layer of a thermally conductive metal to the wafer;(b) electroplating a relatively thick layer of the conductive metal on the seed layer, and(c) removing the substrate. A corresponding semiconductor device is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile